The Polyol Process and the Synthesis of ζ Intermetallic Compound Ag5Sn0.9
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DOI: 10.3390/ma15228276
Abstract: The present work concerns the intermetallic compound (IMC) existing in the Ag–Sn system and its potential use in electronics as attachment materials allowing the adhesion of the chip to the substrate forming the power module.… read more here.
Keywords: compound; intermetallic compound; ag5sn0; synthesis ... See more keywords