Vacuum diffusion bonding of high-entropy Al0.85CoCrFeNi alloy to TiAl intermetallic
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DOI: 10.1016/j.jmatprotec.2019.116455
Abstract: Abstract High-entropy alloy Al0.85CoCrFeNi was joined to TiAl alloy through vacuum diffusion bonding. The typical interfacial microstructure of Al0.85CoCrFeNi/TiAl joint was TiAl/ α2-Ti3Al + solid solution strengthened γ-TiAl / FeNi, AlNiTi / Al(Co, Ni)2Ti /Cr(Fe, Co)ss /… read more here.
Keywords: diffusion; al0 85cocrfeni; high entropy; vacuum diffusion ... See more keywords