Soft and SelfâAdhesive Thermal Interface Materials Based on Vertically Aligned, Covalently Bonded Graphene Nanowalls for Efficient Microelectronic Cooling
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DOI: 10.1002/adfm.202104062
Abstract: Urged by the increasing power and packing densities of integrated circuits and electronic devices, efficient dissipation of excess heat from hot spot to heat sink through thermal interface materials (TIMs) is a growing demand to… read more here.
Keywords: aligned covalently; thermal interface; covalently bonded; interface materials ... See more keywords