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Published in 2022 at "Materials"
DOI: 10.3390/ma15072355
Abstract: As a traditional interconnect material, silver alloy bonding wires are widely used in electronic packaging, but their propensity to vulcanize quickly has not been sufficiently addressed. The current surface anti-oxidation and anti-sulfidation treatments are often…
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Keywords:
bonding performance;
alloy bonding;
silver alloy;
bonding ... See more keywords