Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging
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DOI: 10.3390/polym14142950
Abstract: In this study, the effects of a hybrid filler composed of zero-dimensional spherical AlN particles and two-dimensional BN flakes on the thermal conductivity of epoxy resin were studied. The thermal conductivity (TC) of the pristine… read more here.
Keywords: aln hybrid; hybrid filler; highly thermally; electronic packaging ... See more keywords