Bonding Mechanism of Cold Gas-Sprayed Copper Particles Onto Aluminum Nitride Substrates for Power Electronics Packaging
Sign Up to like & getrecommendations! Published in 2025 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2025.3564520
Abstract: This study investigates the bonding mechanisms between cold gas-sprayed (CGS) copper (Cu) particles and aluminum nitride (AlN) substrates. A 300- $\mu $ m-thick Cu coating was successfully deposited and characterized by electron backscatter diffraction (EBSD)… read more here.
Keywords: aln interface; copper particles; copper; aluminum nitride ... See more keywords