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Published in 2018 at "Journal of Electronic Materials"
DOI: 10.1007/s11664-018-6504-2
Abstract: Bonding between AlN and metals conventionally requires a surface modification process at high temperature such as metallization. The AlN-to-metal direct bonding process by sintering of Ag nanoparticles derived from in situ reduction of Ag2O microparticles…
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Keywords:
aln metal;
direct bonding;
process;
bonding process ... See more keywords