Nanograin‐Twin‐Nanograin Alternating Composite Structure Enable Improved Cross‐Interface Cu─Cu Bonding at Low Thermal Budgets
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DOI: 10.1002/smtd.202500831
Abstract: Chip stacking using through‐silicon via (TSV) and direct copper‐to‐copper (Cu─Cu) bonding technology has emerged as a superior solution to overcome the limitations of Moore's law. However, conventional approaches face a fundamental trade‐off: coarse‐grained Cu requires… read more here.
Keywords: alternating composite; twin nanograin; nanograin alternating; nanograin twin ... See more keywords