Effect of high temperature cycling on both crack formation in ceramics and delamination of copper layers in silicon nitride active metal brazing substrates
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DOI: 10.1016/j.ceramint.2017.01.020
Abstract: Abstract Crack formation in Si 3 N 4 active metal brazing (AMB) ceramic substrates and delamination of copper layers on the AMB substrates subjected to temperature cycling from −40 to 250 °C were investigated to evaluate… read more here.
Keywords: amb substrates; crack formation; thick layers; copper ... See more keywords