Analog Integrated Circuits Based on Wafer-Level Two-Dimensional MoS2 Materials With Physical and SPICE Model
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DOI: 10.1109/access.2020.3034321
Abstract: In this article, accurate physical and SPCIE model of wafer-level monolayer molybdenum disulfide (MoS2) device are developed to guide the devices and circuits design, which is the foundation of high-performance analog chip design. Moreover, the… read more here.
Keywords: analog integrated; spice model; mos2; model ... See more keywords
Analog Integrated Circuit Routing Techniques: An Extensive Review
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DOI: 10.1109/access.2023.3265481
Abstract: Routing techniques for analog and radio-frequency (A/RF) integrated circuit (IC) design automation have been proposed in the literature for over three decades. On those, an extensive set of geometric constraints have already been covered as… read more here.
Keywords: routing techniques; integrated circuit; circuit; analog integrated ... See more keywords