Analyses and design for electrochemical migration suppression by alloying indium into silver
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DOI: 10.1007/s10854-018-9520-3
Abstract: Silver electrochemical migration (ECM) is a serious reliability issue for fine pitch as well as power electronic devices that employ silver as interconnection materials. In this study, a method to suppress the ECM behavior of… read more here.
Keywords: analyses design; electrochemical migration; migration; ecm ... See more keywords