Analysing semiconductor manufacturing big data for root cause detection of excursion for yield enhancement
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DOI: 10.1080/00207543.2015.1109153
Abstract: With the shrinking feature size of integrated circuits driven by continuous technology migrations for wafer fabrication, the control of tightening critical dimensions is critical for yield enhancement, while physical failure analysis is increasingly difficult. In… read more here.
Keywords: big data; analysing semiconductor; semiconductor manufacturing; root ... See more keywords