Analytical thermal stress modeling in electronics and photonics engineering: Application of the concept of interfacial compliance
Sign Up to like & getrecommendations! Published in 2019 at "Journal of Thermal Stresses"
DOI: 10.1080/01495739.2018.1525331
Abstract: Abstract Application of the concept of interfacial compliance in analytical thermal stress modeling in electronics and photonics engineering is addressed. The review is based mostly on the author’s research conducted during his tenure with Bell… read more here.
Keywords: concept interfacial; thermal stress; interfacial compliance; application concept ... See more keywords
A New Analytical Thermal Model of Distributed Winding Wheel Machine for Electric Vehicles
Sign Up to like & getrecommendations! Published in 2022 at "IEEE Transactions on Vehicular Technology"
DOI: 10.1109/tvt.2022.3197903
Abstract: Due to the complex boundary conditions of the thermal analysis method (AM), the error of the calculation results is large, and the lumped-parameter thermal network (LPTN) mostly focuses on the solution of the average temperature.… read more here.
Keywords: temperature; winding wheel; model; thermal model ... See more keywords
Analytical Thermal Boundary Condition for Quasi-Transient Simulation of Internal Flow Experiments
Sign Up to like & getrecommendations! Published in 2021 at "Journal of Thermophysics and Heat Transfer"
DOI: 10.2514/1.t6175
Abstract: Transient thermochromic liquid crystal (TLC) experiments can provide high-fidelity spatially resolved heat transfer data for complex geometries, particularly where infrared techniques cannot be app... read more here.
Keywords: boundary condition; transient simulation; thermal boundary; analytical thermal ... See more keywords