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Published in 2020 at "Modern Physics Letters B"
DOI: 10.1142/s0217984920502565
Abstract: To solve the problems of low efficiency and high void rate in the process of the MEMS filter (die) attach and increase the strength of wire bonding between the die and microwave circuit board, plas...
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Keywords:
mems filter;
application plasma;
plasma cleaning;
process mems ... See more keywords