An Effective Approach for Associating the Sources of Defect Signatures to Process Zones
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DOI: 10.1109/tsm.2017.2679714
Abstract: A semiconductor wafer undergoes various processing steps before it is transformed from a plain silicon wafer to one populated with thousands of integrated circuits. Each of these processing steps is susceptible to specific types of… read more here.
Keywords: defect signatures; semiconductor; approach associating; processing steps ... See more keywords