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Published in 2018 at "Microsystem Technologies"
DOI: 10.1007/s00542-017-3330-z
Abstract: This paper presents a new compact modeling technique to describe the convective heat transfer realized by laminar flow of coolant in integrated microchannels used for thermal management of 3D ICs—with the aim of being able…
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Keywords:
approach microchannel;
validation;
modeling approach;
model ... See more keywords