A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation
Sign Up to like & getrecommendations! Published in 2019 at "IEEE Access"
DOI: 10.1109/access.2019.2913786
Abstract: Due to many advantages, such as cost-effective production, design freedom, and weight reduction, plastics have replaced metals and ceramics in many fields. However, engineering plastics are good thermal insulators. This characteristic, although beneficial in certain… read more here.
Keywords: reliability investigation; novel approach; approach reliability; simulation ... See more keywords
Maximum Entropy Approach to Reliability of Multi-Component Systems with Non-Repairable or Repairable Components
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DOI: 10.3390/e23030348
Abstract: The degradation and recovery processes are multi-scale phenomena in many physical, engineering, biological, and social systems, and determine the aging of the entire system. Therefore, understanding the interplay between the two processes at the component… read more here.
Keywords: approach reliability; non repairable; maximum entropy; approach ... See more keywords