Technological aspects of silver particle sintering for electronic packaging
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DOI: 10.1108/cw-10-2017-0060
Abstract: Purpose This paper aims to find proper technological parameters of low-temperature joining technique by silver sintering to eventually use this technique for reliable electronic packaging. Design/methodology/approach Based on the literature and author’s own experience, the… read more here.
Keywords: electronic packaging; aspects silver; particle sintering; technological aspects ... See more keywords