Heat-Resistant Microporous Ag Die-Attach Structure for Wide Band-Gap Power Semiconductors
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DOI: 10.3390/ma11122531
Abstract: In this work, efforts were made to prepare a thermostable die-attach structure which includes stable sintered microporous Ag and multi-layer surface metallization. Silicon carbide particles (SiCp) were added into the Ag sinter joining paste to… read more here.
Keywords: attach structure; heat resistant; die attach; structure ... See more keywords