A Multilayer Paste Based on Ag Nanoparticles with Cu@Sn for Die Attachment in Power Device Packaging
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DOI: 10.3390/ma15030914
Abstract: A 3–5 μm Cu@Sn core-shell powder was prepared by chemical plating. Based on the mixture of this Cu@Sn and Ag NPs (nanoparticles), a soldering material for third-generation semiconductors was prepared. The joints prepared with this… read more here.
Keywords: attachment power; paste based; die attachment; nanoparticles die ... See more keywords