A Survey of Detection Methods for Die Attachment and Wire Bonding Defects in Integrated Circuit Manufacturing
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DOI: 10.48550/arxiv.2206.07481
Abstract: Defect detection plays a vital role in the manufacturing process of integrated circuits (ICs). Die attachment and wire bonding are two steps of the manufacturing process that determine the power and signal transmission quality and… read more here.
Keywords: die attachment; attachment wire; survey; detection ... See more keywords