Effects of cooling rate and magnetic field on solidification characteristics of Au80Sn20 eutectic solder
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DOI: 10.1007/s10854-017-7932-0
Abstract: The fragility of Au80Sn20 eutectic solder is the major bottleneck of its application, which origins from the coarse primary ζ′-phase and the intrinsic brittleness of irregularly eutectic structure. To tackle this problem, various solidification processes… read more here.
Keywords: magnetic field; cooling rate; au80sn20 eutectic; solidification ... See more keywords