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Published in 2020 at "JOM"
DOI: 10.1007/s11837-020-04286-2
Abstract: Due to its superior chemical stability, mechanical strength, light weight, and flexibility, polyimide (PI) has been widely used as a polymeric substrate of flexible printed circuit boards such as flexible copper clad laminates (FCCLs). The…
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Keywords:
silanization polyimide;
autocatalytic metallization;
metallization;
surface silanization ... See more keywords