Optimization of thermal aware multilevel routing for 3D IC
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DOI: 10.1007/s10470-019-01513-y
Abstract: Due to the technological advancements, the three dimensional Integrated Circuits become the most popular technology. But it has the major drawback of increased time consumption as well power consumption. This happens because of the increased… read more here.
Keywords: aware multilevel; wire length; optimization thermal; wire ... See more keywords