Sign Up to like & get
recommendations!
2
Published in 2022 at "Rapid Communications in Mass Spectrometry"
DOI: 10.1002/rcm.9454
Abstract: Rationale Back‐side thinning of wafers is used to eliminate issues with transient sputtering when analyzing near‐surface element distributions. Precise and accurate calibrated implants are created by including a standard reference material during the implantation. Combining…
read more here.
Keywords:
low fluence;
fluence shallow;
depth profiling;
side ... See more keywords
Sign Up to like & get
recommendations!
0
Published in 2017 at "Colloids and Surfaces A: Physicochemical and Engineering Aspects"
DOI: 10.1016/j.colsurfa.2017.01.030
Abstract: Abstract Nature has always provided a lot of inspirations for engineers and scientists. The butterfly wing is a kind of typical surface that performs excellent properties of superhydrophobicity especially for the front side of the…
read more here.
Keywords:
water;
butterfly wing;
side butterfly;
back side ... See more keywords
Sign Up to like & get
recommendations!
0
Published in 2021 at "Materials Science in Semiconductor Processing"
DOI: 10.1016/j.mssp.2021.105717
Abstract: Abstract Three FTO-BiVO4 photoelectrodes are fabricated modifying the BiVO4 thickness, and systematically evaluating the influence of FTO substrate on the optical, electrical properties, and photoelectrochemical performance of BiVO4 semiconductor. The catalysts are characterized using two…
read more here.
Keywords:
back side;
fto;
illumination;
bivo4 ... See more keywords
Sign Up to like & get
recommendations!
0
Published in 2020 at "IEEE Photonics Technology Letters"
DOI: 10.1109/lpt.2020.3019114
Abstract: Silicon photonic sensors are promising candidates for lab-on-a-chip solutions with versatile applications and scalable production prospects using complementary metal-oxide semiconductor (CMOS) fabrication methods. However, the widespread use has been hindered because the sensing area adjoins…
read more here.
Keywords:
back side;
silicon photonic;
side release;
local back ... See more keywords
Sign Up to like & get
recommendations!
0
Published in 2020 at "Optics express"
DOI: 10.1364/oe.412839
Abstract: We demonstrate foundry-fabricated O-band III-V-on-silicon discrete-mode lasers. The laser fabrication follows the back-side-on-buried-oxide laser integration process and is compatible with complex, multilayer, silicon-on-insulator based platforms. A series of devices were characterized, with the best devices…
read more here.
Keywords:
discrete mode;
band;
mode lasers;
silicon ... See more keywords
Sign Up to like & get
recommendations!
1
Published in 2021 at "Applied Physics Express"
DOI: 10.35848/1882-0786/abe084
Abstract: We propose a structure suitable for surface plasmon resonance (SPR) excitation with light incident on the back-side of the device, which has affinity with the semiconductor process. We constructed a diffraction grating on the top…
read more here.
Keywords:
plasmon resonance;
back side;
surface plasmon;
structure ... See more keywords