Silicon Interposer Package for MMIC Heterogeneous Integration Based on Gold/Solder Ball Flip-Chip Technique
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DOI: 10.1109/tcpmt.2019.2917292
Abstract: Novel silicon interposer package solution is proposed for monolithic microwave integrated circuit (MMIC) heterogeneous integration. The GaAs/InP MMICs are integrated into the high-resistance silicon interposer by the gold ball flip-chip technique. Then, the whole silicon… read more here.
Keywords: interposer package; silicon; ball flip; silicon interposer ... See more keywords