Bonding performance of sintered nanosilver joints on bare copper substrates with different grain structures
Sign Up to like & getrecommendations! Published in 2019 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-019-01601-9
Abstract: Nanosilver paste as a state-of-the-art die-attach material for power electronics has been widely used in bare copper bonding. In this paper, bonding performance of sintered nanosilver joints on bare copper substrates with different grain structures… read more here.
Keywords: performance sintered; bare copper; copper; grain ... See more keywords
Effect of Oxygen Content on Bonding Performance of Sintered Silver Joint on Bare Copper Substrate
Sign Up to like & getrecommendations! Published in 2023 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2023.3264487
Abstract: Optimizing oxygen levels in a sintering atmosphere seems to be a more economical method to realize die-attachment on a bare copper substrate with silver paste. In this article, the effects of oxygen content on the… read more here.
Keywords: bare copper; oxygen content; copper substrate; copper ... See more keywords