Novel Au-Based Solder Alloys: A Potential Answer for Electrical Packaging Problem
Sign Up to like & getrecommendations! Published in 2020 at "Advances in Materials Science and Engineering"
DOI: 10.1155/2020/4969647
Abstract: With the development of electronical technology and the construction of the fifth-generation cellular networks, electronic devices with higher integrated level and power are widely applied. Hence, greater demands are being placed on electronic packaging materials.… read more here.
Keywords: novel based; packaging; solder; solder alloys ... See more keywords
Study on the Application of Modified Sn-Based Solder in Cable Intermediate Joints
Sign Up to like & getrecommendations! Published in 2022 at "Materials"
DOI: 10.3390/ma15238385
Abstract: With the increasing use of underground cables, the quantity and quality of intermediate joints demanded are also increasing. The quality of the traditional crimping intermediate joint is easily affected by the actual process of the… read more here.
Keywords: modified based; cable; intermediate joints; study application ... See more keywords