PMMA-Based Wafer-Bonded Capacitive Micromachined Ultrasonic Transducer for Underwater Applications
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DOI: 10.3390/mi10050319
Abstract: This article presents a new wafer-bonding fabrication technique for Capacitive Micromachined Ultrasonic Transducers (CMUTs) using polymethyl methacrylate (PMMA). The PMMA-based single-mask and single-dry-etch step-bonding device is much simpler, and reduces process steps and cost as… read more here.
Keywords: pmma based; based wafer; underwater applications; micromachined ultrasonic ... See more keywords