Effect of Thermal Mechanical Behaviors of Cu on Stress Distribution in Cu-Filled Through-Silicon Vias Under Heat Treatment
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DOI: 10.1007/s11664-017-5885-y
Abstract: Through-silicon vias (TSV) are facing unexpected thermo-mechanical reliability problems due to the coefficient of thermal expansion (CTE) mismatch between various materials in TSVs. During applications, thermal stresses induced by CTE mismatch will have a negative… read more here.
Keywords: stress distribution; behaviors stress; silicon vias; vias ... See more keywords