Asymmetric Bidirectional Pulse Electrodeposition Enabling Super-Filling of Through Glass Vias With Large Aperture and High Aspect Ratio
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DOI: 10.1109/tcpmt.2025.3543363
Abstract: Electrodeposition is the key to the vertical interconnection of through-glass vias (TGVs) in 3-D packaging. This article proposes an asymmetric bidirectional pulse electrodeposition strategy based on a Nitrotetrazolium Blue Chloride (NBTC) electrodeposition solution system, enabling… read more here.
Keywords: pulse electrodeposition; electrodeposition; bidirectional pulse; asymmetric bidirectional ... See more keywords