Cohesive Properties of Bimaterial Interfaces in Semiconductors: Experimental Study and Numerical Simulation Using an Inverse Cohesive Contact Approach
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DOI: 10.3390/ma17020289
Abstract: Examining crack propagation at the interface of bimaterial components under various conditions is essential for improving the reliability of semiconductor designs. However, the fracture behavior of bimaterial interfaces has been relatively underexplored in the literature,… read more here.
Keywords: using inverse; bimaterial interfaces; approach; cohesive properties ... See more keywords