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Published in 2024 at "Advanced Functional Materials"
DOI: 10.1002/adfm.202315420
Abstract: Next‐generation bioelectronic implants require miniaturization, durability, and long‐term functionality. Thin film encapsulations, prepared with inorganic or hybrid organic/inorganic designs, are essential for ensuring protection, low water permeation, adaptability, and structural strength. It is equally important…
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Keywords:
method;
bioelectronic implants;
thin film;
test universal ... See more keywords