Prior-to-bond annealing effects on the diamond-to-copper heterogeneous integration using silver–indium multilayer structure
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DOI: 10.1007/s10854-020-03346-2
Abstract: In the present study, we have successfully demonstrated the heterogeneous integration of chemical vapor deposition (CVD) diamond and copper (Cu), using a fluxless silver–indium (Ag-In) bonding system. CVD diamond heat spreaders and Cu heat sinks… read more here.
Keywords: spectroscopy; heterogeneous integration; prior bond; bond annealing ... See more keywords