3D Finite Element Simulation from Non-destructive X-ray Tomography and Verification with Novel Mechanical Testing and Digital Image Correlation In-situ of Focused Beam Microscope
Sign Up to like & getrecommendations! Published in 2020 at "Microscopy and Microanalysis"
DOI: 10.1017/s1431927620023831
Abstract: Every electric-powered system whether it is a computer, phone, car, or clock possesses at least one packaged microor nano-electronic device. Traditional methods of mechanical quality assurance for packaged devices are outlined in standards such as… read more here.
Keywords: device; non destructive; bond wire; testing ... See more keywords
Localization and Detection of Bond Wire Faults in Multichip IGBT Power Modules
Sign Up to like & getrecommendations! Published in 2020 at "IEEE Transactions on Power Electronics"
DOI: 10.1109/tpel.2020.2965019
Abstract: Multichip insulated gate bipolar transistor (mIGBT) power modules (PMs) degrade over power cycling. Bond wire lift–off is one of the major failure modes. This article presents a technique to diagnose bond wire lift-off by analyzing… read more here.
Keywords: lift; bond; power modules; bond wire ... See more keywords
Bond Wire Damage Detection Method on Discrete MOSFETs Based on Two-Port Network Measurement
Sign Up to like & getrecommendations! Published in 2022 at "Micromachines"
DOI: 10.3390/mi13071075
Abstract: Bond wire damage is one of the most common failure modes of metal-oxide semiconductor field-effect transistor (MOSFET) power devices in wire-welded packaging. This paper proposes a novel bond wire damage detection approach based on two-port… read more here.
Keywords: network; bond wire; wire damage; wire ... See more keywords