Articles with "bonded interface" as a keyword



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Fatigue behavior of FRP-to-steel bonded interface: An experimental study with a damage plasticity model

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Published in 2020 at "International Journal of Fatigue"

DOI: 10.1016/j.ijfatigue.2020.105785

Abstract: Abstract This study presents an experimental and theoretical investigation into the bond-slip relation of a CFRP-to-steel bonded interface under cyclic loading. It was observed that the peak interfacial shear stress during cyclic loading was lower… read more here.

Keywords: steel bonded; study; bonded interface; cyclic loading ... See more keywords

Research on Machine Learning-Assisted Numerical Simulation Methods for IGBT Module Bonded Interface Fatigue Damage

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Published in 2025 at "IEEE Journal of Emerging and Selected Topics in Power Electronics"

DOI: 10.1109/jestpe.2025.3562891

Abstract: Bonded interface cracking is the primary failure mode of insulated gate bipolar transistor (IGBT) modules during prolonged operation. A numerical simulation method that effectively characterizes fatigue crack propagation at the bonded interface of IGBT modules… read more here.

Keywords: tex math; bonded interface; inline formula;

Torsional Waves in a Fiber Composite Medium at a Loosely Bonded Interface Constrained Between Dry Sandy Layer and Gravitating Poroelastic Substrate

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Published in 2019 at "International Journal of Computational Methods"

DOI: 10.1142/s0219876218400303

Abstract: The objective of this paper is to study the effect of loosely bonded interface on torsional surface wave propagation in a fiber reinforced composite medium constrained between dry sandy layer and an anisotropic gravitating poroelastic… read more here.

Keywords: bonded interface; medium; constrained dry; composite medium ... See more keywords

Using Machine Learning and Finite Element Analysis to Extract Traction-Separation Relations at Bonding Wire Interfaces of Insulated Gate Bipolar Transistor Modules

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Published in 2024 at "Materials"

DOI: 10.3390/ma17051002

Abstract: For insulated gate bipolar transistor (IGBT) modules using wire bonding as the interconnection method, the main failure mechanism is cracking of the bonded interface. Studying the mechanical properties of the bonded interface is crucial for… read more here.

Keywords: bipolar transistor; gate bipolar; finite element; insulated gate ... See more keywords

Investigation of Plasma Activated Si-Si Bonded Interface by Infrared Image Based on Combination of Spatial Domain and Morphology

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Published in 2019 at "Micromachines"

DOI: 10.3390/mi10070445

Abstract: This paper presents a detection method for characterizing the bonded interface of O2 plasma activated silicon wafer direct bonding. The images, obtained by infrared imaging system, were analyzed by the software based on spatial domain… read more here.

Keywords: domain morphology; plasma activated; bonded interface; spatial domain ... See more keywords