Transient Liquid Phase Bonding of 2205 Duplex Stainless Steel Using a Ni-P Interlayer
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DOI: 10.1007/s11665-020-04758-1
Abstract: Transient liquid phase (TLP) bonding was successfully applied to join 2205DSS using a Ni-P interlayer. Microstructural studies revealed that isothermal solidification (IS) progressed via formation of γ-Fe solid solution from the base metal (BM)/bonding zone… read more here.
Keywords: transient liquid; liquid phase; tlp bonded; bonded specimen ... See more keywords