Room temperature bonding of aluminum nitride ceramic and semiconductor substrate
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DOI: 10.1016/j.ceramint.2020.07.083
Abstract: Abstract AlN and Si substrates were bonded at room temperature after sputtering the surfaces under ultra-high vacuum conditions. The bonding strength was insignificant when they were directly bonded. However, the strong bonding equivalent to the… read more here.
Keywords: temperature bonding; bonding aluminum; room temperature; room ... See more keywords