A novel bonding method for fabrication of PMMA nanofluidic chip with low deformation of the nano-trenches
Sign Up to like & getrecommendations! Published in 2018 at "Microfluidics and Nanofluidics"
DOI: 10.1007/s10404-018-2121-x
Abstract: All PMMA-based nanofluidic chips are becoming increasingly important for biological and medical applications. To fabricate PMMA nanofluidic chips, the open nano-trenches should be sealed by thermal bonding method. However, the present thermal bonding method suffers… read more here.
Keywords: bonding method; pmma; nano trenches; pmma nanofluidic ... See more keywords
A low-temperature bonding method for high power device packaging based on In-infiltrated nanoporous Cu
Sign Up to like & getrecommendations! Published in 2020 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-020-03970-y
Abstract: With the rapid development of the third-generation semiconductor materials, an appropriate high-temperature-resistant die attach material has become one of the bottlenecks to fully exploit the excellent properties of the third-generation semiconductor power devices. At the… read more here.
Keywords: low temperature; bonding method; temperature bonding; temperature ... See more keywords
Characterisation of steel/nickel bronze clad strips prepared by continuous solid/liquid bonding method
Sign Up to like & getrecommendations! Published in 2019 at "Materials Science and Technology"
DOI: 10.1080/02670836.2019.1651015
Abstract: ABSTRACT A continuous solid/liquid bonding method was successfully developed to fabricate Cu–10wt-%Ni–1wt-%Fe (nickel bronze) clad steel with a good metallurgical bonding in the present study. The results indicated that the diffusion distance of interface is… read more here.
Keywords: bronze clad; bonding method; continuous solid; nickel bronze ... See more keywords
Single-Sheath Bonding—A New Method to Bond/Ground Cable Sheaths
Sign Up to like & getrecommendations! Published in 2020 at "IEEE Transactions on Power Delivery"
DOI: 10.1109/tpwrd.2019.2929691
Abstract: Single-point bonding for cable sheath is a widely used method to increase cable ampacity. The method requires a dedicated grounding continuity conductor (GCC), which adds to the cost of implementation significantly. This letter proposes a… read more here.
Keywords: point bonding; single sheath; sheath; cable ... See more keywords