Bonding methods for chip integration with Parylene devices
Sign Up to like & getrecommendations! Published in 2021 at "Journal of Micromechanics and Microengineering"
DOI: 10.1088/1361-6439/abe246
Abstract: Flexible electronics require more compact interconnects for next-generation devices. Polymer devices can be bonded to integrated circuit chips, but combining flexible and rigid substrates poses unique technical challenges. Existing technologies either cannot achieve the density… read more here.
Keywords: methods chip; chip integration; bonding methods; integration parylene ... See more keywords
Microfluidic biosensors: exploring various applications through diverse bonding methods
Sign Up to like & getrecommendations! Published in 2024 at "Journal of Micromechanics and Microengineering"
DOI: 10.1088/1361-6439/ad63b3
Abstract: Biological sensors are widely applied in agriculture, biomedicine, food, healthcare, environmental monitoring, water quality, forensics, drug development, etc. Particularly the utilization of microfluidic technology has become prevalent in the development and manufacturing of biosensors for… read more here.
Keywords: bonding methods; microfluidic biosensors; various applications; diverse bonding ... See more keywords
Machining technologies and structural models of microfluidic devices
Sign Up to like & getrecommendations! Published in 2024 at "Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science"
DOI: 10.1177/09544062241237705
Abstract: In the past decades, microfluidic chips have been one of the hottest research topics in the “lab-on-a-chip” field. However, it is still a challenge for design the perfect microchannels with high functional integration, complex geometry,… read more here.
Keywords: structural models; machining technologies; bonding methods; microfluidic devices ... See more keywords