Effects of Thermocompression Bonding Parameters on Cu Pillar/Sn-Ag Microbump Solder Joint Morphology Using Nonconductive Films
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DOI: 10.1109/tcpmt.2016.2641040
Abstract: In this paper, wafer-level preapplied nonconductive films (NCFs) were used to interconnect the Cu pillar/Sn-Ag microbumps for 3-D through silicon via vertical interconnection. Thermocompression bonding is a common method to interconnect chips to substrates using… read more here.
Keywords: isothermal bonding; solder joint; joint; bonding parameters ... See more keywords