Impact of Bonding Pressure on the Reactive Bonding of LTCC Substrates
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DOI: 10.3390/mi16030321
Abstract: Reactive bonding can overcome the issues associated with conventional soldering processes, such as potential damage to heat-sensitive components and the creation of thermomechanical stress due to differing coefficients of thermal expansion. The risk of such… read more here.
Keywords: pressure; reactive bonding; bonding pressure; impact bonding ... See more keywords