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1
Published in 2017 at "Journal of Electronic Materials"
DOI: 10.1007/s11664-017-5357-4
Abstract: A transient liquid phase sintering (TLPS) bonding process, Ni-Sn TLPS bonding was developed for the new generation of power semiconductor packaging. A model Ni/Ni-Sn/Ni sandwiched structure was assembled by using 30Ni-70Sn mixed powder as the…
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Keywords:
transient liquid;
temperature;
liquid phase;
bonding process ... See more keywords
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1
Published in 2018 at "Journal of Electronic Materials"
DOI: 10.1007/s11664-018-6504-2
Abstract: Bonding between AlN and metals conventionally requires a surface modification process at high temperature such as metallization. The AlN-to-metal direct bonding process by sintering of Ag nanoparticles derived from in situ reduction of Ag2O microparticles…
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Keywords:
aln metal;
direct bonding;
process;
bonding process ... See more keywords
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Published in 2018 at "Journal of Electronic Materials"
DOI: 10.1007/s11664-018-6727-2
Abstract: In this study, a low-cost aluminum nitride (AlN) sintering process to produce thick AlN film substrate with a high thermal conductivity is developed. The thermal conductivity of the present produced thick AlN film substrate is…
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Keywords:
die;
aluminum nitride;
die bonding;
bonding process ... See more keywords
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0
Published in 2018 at "Journal of Manufacturing Processes"
DOI: 10.1016/j.jmapro.2018.07.005
Abstract: Abstract Similar diffusion bonding of a duplex stainless steel (Cr25Ni7Mo4MnSi) was performed using a Gleeble 3500 thermo-mechanical simulator. Isostatic diffusion bonding was carried out at 1100 °C. The effect of surface condition, cold rolling, holding time…
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Keywords:
duplex stainless;
diffusion;
stainless steel;
bonding process ... See more keywords
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Published in 2017 at "Journal of Microelectromechanical Systems"
DOI: 10.1109/jmems.2017.2675987
Abstract: The introduction of wafer-bonding technique to capacitive micromachined ultrasonic transducer (CMUT) fabrication offered advantages over the surface micromachining technique, such as simplified fabrication, better membrane uniformity, and increased active area. The conventional wafer-bonding CMUT process…
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Keywords:
wafer bonding;
cmut fabrication;
fabrication;
bonding process ... See more keywords
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Published in 2019 at "Journal of Composite Materials"
DOI: 10.1177/0021998318781462
Abstract: Accumulative roll bonding was successfully used as a severe plastic deformation method to produce Al–SiC composite sheets. The effect of the addition of SiC particles on the microstructural evolution and mechanical properties of the composites…
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Keywords:
roll;
microscopy;
roll bonding;
bonding process ... See more keywords
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2
Published in 2017 at "Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications"
DOI: 10.1177/1464420716665649
Abstract: Fusion bonding is an innovative joining technology which enables connecting load-adapted material combinations, such as metals with thermoplastic polymers or fibre-reinforced polymers. The bonding process is facilitated by inductively or conductively heating the metallic joining…
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Keywords:
process;
fusion bonding;
numerical illustration;
bonding process ... See more keywords
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2
Published in 2022 at "Materials"
DOI: 10.3390/ma15155158
Abstract: The aim of the paper is to determine the influence of the surface treatment on the adhesive properties of steel sheet surfaces and the strength of the adhesive joints of steel sheets. The paper also…
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Keywords:
surface treatment;
steel;
bonding process;
surface ... See more keywords