Investigations of silicon wafer bonding utilizing sputtered Al and Sn films
Sign Up to like & getrecommendations! Published in 2017 at "Microsystem Technologies"
DOI: 10.1007/s00542-016-2982-4
Abstract: Nowadays, wafer bonding is becoming a key enabling technology for three-dimensional (3D) packaging, micro-electro-mechanical systems (MEMS) encapsulation and heterogeneous integration. This paper develops and investigates entire Si wafer bonding based on thin Al and Sn… read more here.
Keywords: silicon wafer; bonding utilizing; investigations silicon; wafer bonding ... See more keywords
Improving Erosion Resistance of Plasma-Sprayed Ceramic Coatings by Elevating the Deposition Temperature Based on the Critical Bonding Temperature
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Thermal Spray Technology"
DOI: 10.1007/s11666-017-0633-7
Abstract: Interlamellar bonding within plasma-sprayed coatings is one of the most important factors dominating the properties and performance of coatings. The interface bonding between lamellae significantly influences the erosion behavior of plasma-sprayed ceramic coatings. In this… read more here.
Keywords: temperature; bonding; erosion; ceramic coatings ... See more keywords
Modified pulse laser deposition of Ag nanostructure as intermediate for low temperature Cu-Cu bonding
Sign Up to like & getrecommendations! Published in 2018 at "Applied Surface Science"
DOI: 10.1016/j.apsusc.2018.03.076
Abstract: Abstract To lower the Cu-Cu bonding temperature and save the time of the bonding process applied for 3D integration, the Ag nanostructure deposited by pulsed laser deposition (PLD) was designed and decorated on the Cu… read more here.
Keywords: laser deposition; bonding temperature; temperature; nanostructure ... See more keywords
Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles
Sign Up to like & getrecommendations! Published in 2023 at "ACS Applied Materials & Interfaces"
DOI: 10.1021/acsami.2c21229
Abstract: Semiconductor packaging continues to reduce in thickness following the overall thinning of electronic devices such as smartphones and tablets. As the package becomes thinner, the warpage of the semiconductor package becomes more important due to… read more here.
Keywords: packaging; modified cure; cure; package ... See more keywords
Reduction of Diffusion Bonding Temperature with Recrystallization at Austenitic Stainless Steel
Sign Up to like & getrecommendations! Published in 2017 at "Isij International"
DOI: 10.2355/isijinternational.isijint-2016-693
Abstract: To produce a fine, precise structure required in microelectronic-mechanical systems (MEMS), various methods have been proposed that depend on the type of material used. A recently developed production method of metal MEMS is diffusion bonding… read more here.
Keywords: temperature; austenitic stainless; stainless steel; bonding temperature ... See more keywords
Effect of joining temperature on Al2024/Ag/Ti-6Al-4V joints during transient liquid phase bonding
Sign Up to like & getrecommendations! Published in 2020 at "International Journal of Materials Research"
DOI: 10.3139/146.111902
Abstract: Abstract The objective of this study is to investigate the effect of bonding temperature on the microstructure and mechanical properties of Al2024 and Ti-6Al-4V diffusion bonds using a 30 μm pure silver foil as interlayer.… read more here.
Keywords: temperature; microscopy; al2024 6al; effect joining ... See more keywords