Investigations of silicon wafer bonding utilizing sputtered Al and Sn films
Sign Up to like & getrecommendations! Published in 2017 at "Microsystem Technologies"
DOI: 10.1007/s00542-016-2982-4
Abstract: Nowadays, wafer bonding is becoming a key enabling technology for three-dimensional (3D) packaging, micro-electro-mechanical systems (MEMS) encapsulation and heterogeneous integration. This paper develops and investigates entire Si wafer bonding based on thin Al and Sn… read more here.
Keywords: silicon wafer; bonding utilizing; investigations silicon; wafer bonding ... See more keywords
Effect of bonding time on microstructure and mechanical properties of diffusion brazed IN-939
Sign Up to like & getrecommendations! Published in 2019 at "Journal of Materials Processing Technology"
DOI: 10.1016/j.jmatprotec.2018.10.021
Abstract: Abstract The applicability of the diffusion brazing technique for joining IN-939 superalloy using a Ni-Cr-B interlayer was assessed. The phases formed during the brazing process in the isothermally solidified zone (ISZ), athermally solidified zone (ASZ)… read more here.
Keywords: time; microstructure mechanical; effect bonding; bonding time ... See more keywords
Comparison of the failure rate, bonding time and ARI score of two orthodontic bonding systems: Self-Ech Primer and Conventional Eching Primer: A systematic review and meta-analysis.
Sign Up to like & getrecommendations! Published in 2021 at "International orthodontics"
DOI: 10.1016/j.ortho.2021.09.001
Abstract: OBJECTIVE This study aimed to evaluate the failure incidence of brackets with at least six months follow-up between self-etch primer and conventional etch/primer, as well as to investigate the clinical duration of the bonding process… read more here.
Keywords: systematic review; etch primer; primer conventional; bonding time ... See more keywords