Investigations of silicon wafer bonding utilizing sputtered Al and Sn films
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DOI: 10.1007/s00542-016-2982-4
Abstract: Nowadays, wafer bonding is becoming a key enabling technology for three-dimensional (3D) packaging, micro-electro-mechanical systems (MEMS) encapsulation and heterogeneous integration. This paper develops and investigates entire Si wafer bonding based on thin Al and Sn… read more here.
Keywords: silicon wafer; bonding utilizing; investigations silicon; wafer bonding ... See more keywords