Articles with "bonding void" as a keyword



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Surface tracking of diffusion bonding void closure and its application to titanium alloys

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Published in 2019 at "International Journal of Material Forming"

DOI: 10.1007/s12289-019-01489-0

Abstract: Diffusion bonding is a process by which two flat, usually metallic, surfaces are welded together at a high temperature and moderate pressure. Bonding occurs due to a combination of diffusion and power law creep that… read more here.

Keywords: surface; diffusion bonding; diffusion; surface tracking ... See more keywords