The Impact of Connection Failure of Bonding Wire on Signal Transmission in Radio Frequency Circuits
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DOI: 10.1109/tcpmt.2020.3019803
Abstract: Bonding wires are widely used in microwave circuits and chip packaging. The exposure to harsh environments may lead to connection failure in these wires. In this article, the impact of such failures on signal transmission… read more here.
Keywords: failure; model; bonding wire; transmission ... See more keywords
The Impact of Bonding Wire Failure in Microelectronic Package on Near-Field Radiation
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DOI: 10.1109/tcpmt.2024.3454166
Abstract: Bonding wires are extensively used in microelectronic package, providing electrical and mechanical interconnections. However, the bonding wire failure is one of the main failure modes during chip operation, which will result in radiation leakage. Accordingly,… read more here.
Keywords: field; bonding wire; field radiation; near field ... See more keywords