Investigation of the Effect of Bonding Wires Degradation on Switching Stress Waves Released During Power Cycling in Discrete IGBT
Sign Up to like & getrecommendations! Published in 2025 at "IEEE Journal of Emerging and Selected Topics in Power Electronics"
DOI: 10.1109/jestpe.2025.3532692
Abstract: Effective condition monitoring (CM) technology ensures the safe operation of insulated gate bipolar transistors (IGBTs). Most CM methods for IGBTs focus on extracting electrical, thermal, and magnetic parameters. Recent studies indicate that at the switching… read more here.
Keywords: degradation; bonding wires; power cycling; power ... See more keywords
In Situ Monitoring Bonding Wires Fatigue in IGBT Power Modules Using Differential Mode Impedance Extracted From Dual Current Probe Technology
Sign Up to like & getrecommendations! Published in 2025 at "IEEE Transactions on Instrumentation and Measurement"
DOI: 10.1109/tim.2025.3551980
Abstract: Bonding wires fatigue is a common fatigued mode of power modules, and in situ monitoring of bonding wires fatigue in insulate-gate bipolar transistor (IGBT) modules is highly efficient and economical for improving reliability. In this… read more here.
Keywords: bonding wires; current probe; wires fatigue; dual current ... See more keywords