Interfacial Band Engineering of MoS2/Gold Interfaces Using Pyrimidine‐Containing Self‐Assembled Monolayers: Toward Contact‐Resistance‐Free Bottom‐Contacts
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DOI: 10.1002/aelm.202000110
Abstract: Bottom‐contact architectures with common electrode materials such as gold are crucial for the integration of 2D semiconductors into existing device concepts. The high contact resistance to gold—especially for bottom contacts—is, however, a general problem in… read more here.
Keywords: self assembled; contact resistance; pyrimidine containing; contact ... See more keywords